Mainboard GIGABYTE B365M-D2V (Intel B365, Socket 115, m-ATX, 2 khe RAM DDR)

Support for 9th and 8h Generation Inl® Core™ procors/Intel® Corerocessors/Intel® Core™ocessors/ Inte Core™ i3 processors/Intel® Pentium® processors/Intel® Celeron® processors in the LG111 package L3 cache varies with CPU

2 x DDR4 DIMM sockets supporting up to 2 GB f system memory Dual channel memory architecture Supportfor DDR4 266/2400/133 Mz memory modules Support for ECC Un-buffeed IM 1Rx8/2Rx8 memory mdules (operate in non-ECC mode) Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modulesSupprt forxtreme Memory Profile (XMP) memory modules

1 x PCI Express x16 slot,running at x16 2CI Express x1 slots (All of the PI Express slots conm to PCI xpress 3 standard.)

Intel® 65 Expss Chipset

Chipset: 6 x USB 3 Gen 1 ports (4 ports on the back panorts available through the i USB header) 6 x 2.0/1.1 ports orts on the baanel, 4 ports available through the inrnal USB headers)

Realek® GbEAN chip (1/1000 Mbit)

Reak® ALC887 codec High Definitiondio 2/4/5.1/-channel

Support for Wind0 4-bt

1 x PS/2 mouse port 1 x PS/2 Keyboa port 1 x D-Sub x I-D port 4 x1 Gen 1 ports 2 x U/1.1 ports 1 -45 port 3 x audo jack

1 x 24-pin ATX main power connector 1 x 8-pin A power connector 1 x CPeader 1 x system faer 1 x M.2 Sock connector 6 ATA 6Gb/s con 1 x front panel header 1 x front panel audio header 1 x USB 3.1 Gen 1 header 2 x USB 2.0/1.1 headers 1 x Trusted Platform Module (TPM) header (x6 pin, fr the GC-TPM_S module only) serial port hder 1 x CleCMOS jump

Miro ATX ormFactor; 22.cm x 15m